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| AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet 1.0 General Description The AMIS-42665 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. The AMIS-42665 is a new addition to the CAN high-speed transceiver family and offers the following additional features: * * * Ideal passive behaviour when supply voltage is removed Wake-up over bus Extremely low current standby mode Due to the wide common-mode voltage range of the receiver inputs, the AMIS-42665 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals. 2.0 Key Features * * * * * * * * * * * * * * * Compatible with the ISO 11898 standard (ISO 11898-2, ISO 11898-5 and SAE J2284) High speed (up to 1Mbaud) Ideally suited for 12V and 24V industrial and automotive applications Extremely low current standby mode with wake-up via the bus Low EME common-mode choke is no longer required Differential receiver with wide common-mode range (+/- 35V) for high EMS Voltage source via VSPLIT pin for stabilizing the recessive bus level (further EMC improvement) No disturbance of the bus lines with an un-powered node Transmit data (TxD) dominant time-out function Thermal protection Bus pins protected against transients in an automotive environment Power down mode in which the transmitter is disabled Bus and VSPLIT pins short circuit proof to supply voltage and ground Logic level inputs compatible with 3.3V devices At least 110 nodes can be connected to the same bus. 3.0 Ordering Information Marketing Name AMIS42665AGA AMIS42665ALA Package SOIC 150 8 GREEN (JEDEC MS-012) SOIC 150 8 GREEN (NiPdAu, JEDEC MS-012) Temp. Range -40C...125C -40C...125C AMI Semiconductor - Rev. 3.1, April 06 www.amis.com 1 AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet 4.0 Technical Characteristics Table 1: Technical Characteristics Symbol Parameter VCC Power supply voltage VSTB DC voltage at pin STB VTxD DC voltage at pin TxD VRxD DC voltage at pin RxD VCANH DC voltage at pin CANH VCANL DC voltage at pin CANL VSPLIT DC voltage at pin VSPLIT VO(dif)(bus_dom) Differential bus output voltage in dominant state CM-range Input common-mode range for comparator VCM-peak Cload tpd(rec-dom) Symbol t pd(dom-rec) VCM-step Tjunc Common-mode peak Load capacitance on IC outputs Propagation delay TxD to RxD Parameter Propagation delay TxD to RxD Common-mode step Junction temperature Conditions 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit 42.5 < RLT < 60 Guaranteed differential receiver threshold and leakage current See Figure 8 and 9 (Note) See Figure 5 Conditions See Figure 5 See Figure 8 and 9 (Note) Min. 4.75 -0.3 -0.3 -0.3 -35 -35 -35 1.5 -35 -500 70 Min. 100 -150 -40 Max. 5.25 VCC VCC VCC +35 +35 +35 3 +35 500 15 230 Max. 245 150 150 Unit V V V V V V V V V mV pF ns Unit ns mV C Note: The parameters VCM-peak and VCM-step guarantee low EME. 5.0 Block Diagram VCC 3 VCC AMIS-42665 POR 7 TxD 1 Timer VCC CANH VSPLIT CANL Thermal shutdown VCC VSPLIT Mode & wake-up control 5 STB 8 Driver control 6 RxD GND 4 Wake-up Filter COMP 2 COMP PC20050211.1 Figure 1: Block Diagram AMI Semiconductor - Rev. 3.1, April 06 www.amis.com 2 AMIS-42665 High-Speed Low Power CAN Transceiver 6.0 Typical Application 6.1 Application Schematic Data Sheet VBAT IN 5V-reg OUT VCC STB 8 3 7 VCC RLT = 60 CANH CAN controller RxD 4 AMIS42665 5 VSPLIT CLT = 47 nF CAN BUS TxD 1 2 6 CANL RLT = 60 GND PC20040829.3 GND Figure 2: Application Diagram 6.2 Pin Description TxD GND VCC RxD 1 8 STB CANH CANL VSPLIT AMIS42665 2 3 4 7 6 5 PC20040829.1 Figure 3: Pin Configuration Table 2: Pinout Pin Name Description 1 TxD Transmit data input; low input => dominant driver; internal pull-up current 2 GND Ground 3 VCC Supply voltage 4 RxD Receive data output; dominant transmitter => low output 5 VSPLIT Common-mode stabilization output 6 CANL Low-level CAN bus line (low in dominant mode) 7 CANH High-level CAN bus line (high in dominant mode) 8 STB Standby mode control input AMI Semiconductor - Rev. 3.1, April 06 3 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver 7.0 Functional Description 7.1 Operating Modes Data Sheet AMIS-42665 provides two modes of operation as illustrated in Table 3. These modes are selectable through pin STB. Table 3: Operating Modes Pin Pin RXD Mode STB Low High Normal Low Bus dominant Bus recessive Standby High Wake-up request detected No wake-up request detected 7.1.1. Normal Mode In the normal mode, the transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimized to give extremely low EME. 7.1.2. Standby Mode In standby mode both the transmitter and receiver are disabled and a very low-power differential receiver monitors the bus lines for CAN bus activity. The bus lines are terminated to ground and supply current is reduced to a minimum, typically 10A. When a wake-up request is detected by the low-power differential receiver, the signal is first filtered and then verified as a valid wake signal after a time period of tBUS, the RxD pin is driven low by the transceiver to inform the controller of the wake-up request. 7.2 Split Circuit The VSPLIT pin is operational only in normal mode. In standby mode this pin is floating. The VSPLIT is connected as shown in Figure 2 and its purpose is to provide a stabilized DC voltage of 0.5 x VCC to the bus avoiding possible steps in the common-mode signal therefore reducing EME. These unwanted steps could be caused by an un-powered node on the network with excessive leakage current from the bus that shifts the recessive voltage from its nominal 0.5 x VCC voltage. 7.3 Wake-up Once a valid wake-up (dominant state longer than tBUS) has been received during the standby mode the RxD pin is driven low. 7.4 Over-temperature Detection A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection circuit is particularly needed when a bus line short circuits. 7.5 TxD Dominant Time-out Function A TxD dominant time-out timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if pin TxD is forced permanently low by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TxD. If the duration of the low-level on pin TxD exceeds the internal timer value tdom, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TxD. This TxD dominant time-out time (tdom)defines the minimum possible bit rate to 40kBaud. 7.6 Fail Safe Features A current-limiting circuit protects the transmitter output stage from damage caused by accidental short circuit to either positive or negative supply voltage, although power dissipation increases during this fault condition. AMI Semiconductor - Rev. 3.1, April 06 4 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet The pins CANH and CANL are protected from automotive electrical transients (according to ISO 7637; see Figure 4). Pins TxD and STB are pulled high internally should the input become disconnected. Pins TxD, STB and RxD will be floating, preventing reverse supply should the VCC supply be removed. 8.0 Electrical Characteristics 8.1 Definitions All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin; sourcing current means the current is flowing out of the pin. 8.2 Absolute Maximum Ratings Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability. Table 4: Absolute Maximum Ratings Symbol Parameter Supply voltage VCC DC voltage at pin CANH VCANH DC voltage at pin CANL VCANL DC voltage at pin VSPLIT VSPLIT DC voltage at pin TxD VTxD DC voltage at pin RxD VRxD DC voltage at pin STB VSTB Transient voltage at pin CANH Vtran(CANH) Transient voltage at pin CANL Vtran(CANL) Transient voltage at pin VSPLIT Vtran(VSPLIT) Conditions Min. -0.3 -50 -50 -50 -0.3 -0.3 -0.3 -300 -300 -300 Max. +7 +50 +50 +50 VCC + 0.3 VCC + 0.3 VCC + 0.3 +300 +300 +300 Unit V V V V V V V V V V 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit Note 1 Note 1 Note 1 Note 2 Note 4 Note 2 Note 4 Note 3 Vesd(CANL/CANH/ VSPLIT) Electrostatic discharge voltage at CANH and CANL pin Electrostatic discharge voltage at all other pins Static latch-up at all pins Storage temperature Ambient temperature Maximum junction temperature -8 -500 -5 -500 -55 -40 -40 +8 +500 +5 +500 120 +150 +125 +170 kV V kV V mA C C C Vesd Latch-up Tstg Tamb Tjunc Notes: 1) Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4). 2) Standardized human body model electrostatic discharge (ESD) pulses in accordance to MIL883 method 3015.7. 3) Static latch-up immunity: Static latch-up protection level when tested according to EIA/JESD78. 4) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993. 8.3 Thermal Characteristics Table 5: Thermal Characteristics Symbol Parameter Thermal resistance from junction to ambient in SO8 package Rth(vj-a) Thermal resistance from junction to substrate of bare die Rth(vj-s) Conditions In free air In free air Value 145 45 Unit K/W K/W AMI Semiconductor - Rev. 3.1, April 06 5 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet 8.4 Characteristics VCC = 4.75 to 5.25V; Tjunc = -40 to +150C; RLT =60 unless specified otherwise. Table 6: Characteristics Symbol Parameter Supply (pin VCC) Supply current ICC Supply current in standby mode Transmitter Data Input (pin TxD) High-level input voltage VIH Low-level input voltage VIL High-level input current IIH Low-level input current IIL Input capacitance Ci Transmitter Mode Select (pin STB) High-level input voltage VIH Low-level input voltage VIL High-level input current IIH Low-level input current IIL Input capacitance Ci Receiver Data Output (pin RxD) High-level output voltage VOH Low-level output voltage VOL High-level output current Ioh Low-level output current Iol Bus Lines (pins CANH and CANL) Recessive bus voltage Vo(reces) (norm) Conditions Min. Typ. Max. Unit ICCS Dominant; VTxD = 0V Recessive; VTxD = VCC Tjunc,max = 100C Output recessive Output dominant 2.0 -0.3 -5 -75 2.0 -0.3 -5 -1 0.6 x VCC -5 5 2.0 -100 -2.5 -2.5 3.0 0. 5 1.5 -120 -45 45 0.5 0.40 50 15 15 -3 25 45 4 10 0 -200 5 0 -4 5 65 8 15 VCC + 0.3 +0.8 +5 -350 10 VCC + 0.3 +0.8 +5 -10 10 0.75 x VCC 0.45 -15 15 3.0 100 +2.5 +2.5 4.25 1.75 3.0 +50 -120 120 0.9 1.00 100 37 37 +3 75 20 20 10 mA mA A V V A A pF V V A A pF V V mA mA V mV mA mA V V V mV mA mA V V mV K K % K pF pF pF VTxD =VCC VTxD = 0V Not tested Standby mode Normal mode VSTB =VCC VSTB = 0V Not tested IRXD = -10mA IRXD = 5mA Vo = 0.7 x VCC Vo = 0.3 x VCC VTxD = VCC; no load normal mode VTxD = VCC; no load standby mode -35V Vo(reces) (stby) Io(reces) (CANH) Io(reces) (CANL) Vo(dom) (CANH) Vo(dom) (CANL) Vo(dif) (bus_dom) Vo(dif) (bus_rec) Io(sc) (CANH) Io(sc) (CANL) Vi(dif) (th) Vihcm(dif) (th) Vi(dif) (hys) Ri(cm) (CANH) Ri(cm) (CANL) Ri(cm) (m) Ri(dif) Ci(CANH) Ci(CANL) Ci(dif) Recessive bus voltage Recessive output current at pin CANH Recessive output current at pin CANL Dominant output voltage at pin CANH Dominant output voltage at pin CANL Differential bus output voltage (VCANH - VCANL) Differential bus output voltage (VCANH - VCANL) Short circuit output current at pin CANH Short circuit output current at pin CANL Differential receiver threshold voltage (see Figure 5) Differential receiver threshold voltage for high common-mode (see Figure 5) Differential receiver input voltage hysteresis (see Figure 5) Common-mode input resistance at pin CANH Common-mode input resistance at pin CANL Matching between pin CANH and pin CANL common mode input resistance Differential input resistance Input capacitance at pin CANH Input capacitance at pin CANL Differential input capacitance VCANH = VCANL VTxD = VCC; not tested VTxD = VCC; not tested VTxD = VCC; not tested AMI Semiconductor - Rev. 3.1, April 06 6 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet Table 6: Characteristics (Continued) Symbol Parameter Common-mode Stabilization (pin VSPLIT) Reference output voltage at pin VSPLIT VSPLIT VSPLIT leakage current VSPLIT limitation current Power-on-Reset (POR) PORL POR level Conditions Min. Typ. Max. Unit ISPLIT(i) ISPLIT(lim) Normal mode; -500A < ISPLIT < 500A Standby mode Normal mode CANH, CANL, Vref in tristate below POR level 0.3 x VCC -5 -3 2.2 - 0.7 x VCC +5 +3 A mA V 3.5 4.7 Thermal Shutdown Shutdown junction temperature Tj(sd) Timing Characteristics (see Figure 4 and Figure 5) Delay TXD to bus active td(TxD-BUSon) 150 160 85 60 55 100 180 105 105 105 105 230 245 C ns ns ns ns ns ns s s s td(TxD-BUSoff) td(BUSon-RXD) td(BUSoff-RXD) tpd(rec-dom) td(dom-rec) td(stb-nm) tdbus tdom(TxD) Delay TXD to bus inactive Delay bus active to RXD Delay bus inactive to RXD Propagation delay TXD to RXD from recessive to dominant Propagation delay TXD to RXD from dominant to recessive Delay standby mode to normal mode Dominant time for wake-up via bus TxD dominant time for time out Cl = 100pF CANH to CANL Cl = 100pF CANH to CANL Crxd = 15pF Crxd = 15pF Cl = 100pF CANH to CANL Cl = 100pF CANH to CANL between between 40 30 25 40 90 90 5 0.75 300 between between VTxD = 0V 7.5 2.5 650 10 5 1000 8.5 Measurement Set-Ups and Definitions +5 V 100 nF 3 VCC 7 1 CANH 1 nF TxD AMIS42665 RxD 4 8 2 5 VSPLIT 1 nF Transient Generator 6 CANL 15 pF STB GND PC20040829.5 Figure 4: Test Circuit for Automotive Transients AMI Semiconductor - Rev. 3.1, April 06 7 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet VRxD High Low Hysteresis PC20040829.7 0,5 0,9 Vi(dif)(hys) Figure 5: Hysteresis of the Receiver +5 V 100 nF 3 VCC 7 1 TxD CANH RLT VSPLIT 60 CLT 100 pF AMIS42665 RxD 4 8 2 5 6 CANL PC20040829.4 15 pF STB GND Figure 6: Test Circuit for Timing Characteristics AMI Semiconductor - Rev. 3.1, April 06 8 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet TxD HIGH LOW CANH CANL dominant Vi(dif) = VCANH - VCANL 0,9V 0,5V recessive RxD 0,3 x VCC 0,7 x VCC td(TxD-BUSon) tpd(rec-dom) td(TxD-BUSoff) td(BUSon-RxD) tpd(dom-rec) td(BUSoff-RxD) PC20040829.6 Figure 7: Timing Diagram for AC Characteristics +5 V 100 nF 3 VCC 7 1 TxD CANH 6.2 k 10 nF Active Probe Generator RxD 4 AMIS42665 6 CANL 6.2 k 30 Spectrum Anayzer 5 8 2 VSPLIT 30 47 nF 15 pF STB GND PC20040829.9 Figure 8: Basic Test Setup for Electromagnetic Measurement AMI Semiconductor - Rev. 3.1, April 06 9 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet Figure 9: EME Measurements AMI Semiconductor - Rev. 3.1, April 06 10 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver Data Sheet 9.0 Package Outline SOIC-8: Plastic small outline; 8 leads; body width 150mil. AMIS reference: SOIC150 8 150 G AMI Semiconductor - Rev. 3.1, April 06 11 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver 10.0 Soldering 10.1 Introduction to Soldering Surface Mount Packages Data Sheet This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 10.2 Re-flow Soldering Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 250C. The top-surface temperature of the packages should preferably be kept below 230C. 10.3 Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): * Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board; * Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 10.4 Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320C. Soldering Method Wave BGA, SQFP Not suitable HLQFP, HSQFP, HSOP, Not suitable (2) HTSSOP, SMS PLCC (3) , SO, SOJ Suitable LQFP, QFP, TQFP Not recommended (3)(4) SSOP, TSSOP, VSO Not recommended (5) Package Re-flow(1) Suitable Suitable Suitable Suitable Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. AMI Semiconductor - Rev. 3.1, April 06 12 www.amis.com AMIS-42665 High-Speed Low Power CAN Transceiver 11.0 Company or Product Inquiries Data Sheet For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com. North America Tel: +1.208.233.4690 Fax: +1.208.234.6795 Europe Tel: +32 (0) 55.33.22.11 Fax: +32 (0) 55.31.81.12 Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright (c)2005 AMI Semiconductor, Inc. AMI Semiconductor - Rev. 3.1, April 06 13 www.amis.com |
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